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AI-Generated Content Disclaimer

This report is automatically generated by an AI investment research system. AI excels at large-scale data organization, financial trend analysis, multi-dimensional cross-comparison, and structured valuation modeling; however, it has inherent limitations in assessing management intent, predicting unforeseen events, capturing market sentiment inflection points, and obtaining non-public information.

This report serves solely as reference material for investment research and does not constitute any recommendation to buy, sell, or hold. Before making investment decisions, please consider your own risk tolerance and consult with a licensed financial advisor. Investing involves risks; exercise caution when entering the market.

Deep Dive Comparative Analysis of the Semiconductor Equipment Big Four (AMAT · LRCX · ASML · KLAC)

Report Type: Comparative Analysis
Data Snapshot: 2026-02-24


Chapter 1: Key Conclusions at a Glance

Company Overall Score Tier Conditional Rating One-Liner
ASML 7.78 T1 Watch King of EUV Monopoly — The semiconductor equipment asset with the highest certainty
KLAC 7.65 T1 Watch King of Efficiency — The "semiconductor software company" with the best risk-adjusted returns
LRCX 6.50 T2 Conditional Watch King of Momentum — A high-beta bet on the AI supercycle
AMAT 5.19 T3 Neutral Watch The Generalist's Dilemma — A cheap but fairly priced EPIC option

Probability-Weighted Expected Return: KLAC(+17.7%) > ASML(+4.2%) > AMAT(-22.4%) > LRCX(-24.9%)
Optimal Two-Stock Portfolio: ASML + KLAC (Complementary Moats + Uncorrelated Risks)


Valuation Snapshot (2026-02-24)

Metric AMAT LRCX ASML KLAC
Share Price $373.55 $242.27 €1,485.99 $1,487.66
Market Cap ($B) $296.5 $302.5 $576.0 $195.5
P/E (TTM) 37.9x 50.9x 51.7x 49.0x
Gross Margin 48.7% 49.8% 52.8% 61.9%
ROIC 45.8% 74.3% 135.6% 78.3%
FCF Yield 2.11% 2.13% 2.25% 1.97%

Macro Environment: Shiller P/E = 39.78 (98th percentile) | Buffett Indicator = 217% (99th percentile)


Scoring System

A-Score (Moat, 0-10): ASML(8.12) > KLAC(7.66) > LRCX(7.02) > AMAT(5.42)
B2 (Unit Economics): KLAC(8.5) > ASML(7.8) > LRCX(7.3) > AMAT(4.9)
B3 (Capital Efficiency): KLAC(8.6) > LRCX(7.4) = ASML(7.4) > AMAT(5.0)
B4 (Valuation Reasonableness): ASML(7.30) > KLAC(5.95) > AMAT(5.20) > LRCX(3.55)
B5 (Risk Defense): KLAC(8.0) > ASML(7.0) > LRCX(5.5) > AMAT(4.5)


Table of Contents

Overview

Part I · Industry Background

Part II · Moat Analysis (A-Score)

Part III · Economic & Valuation Analysis (B-Score)

Part IV · Cross-Analysis

Part V · Decision Framework

Appendices

Chapter 2: WFE Market Structure and Cyclical Positioning

Core Thesis: The global WFE market is in the fourth consecutive year of an AI-driven upcycle (CY2024-CY2027E), an unprecedented event in the last 30 years. While all four companies share the same macro-cyclical backdrop, the transmission paths and magnitudes of cyclical shocks differ significantly due to variations in product category exposure, recurring revenue buffers, and order backlog depth. From a cyclical perspective, KLAC presents the most attractive investment case—offering the strongest downside protection (Beta<1), the highest recovery resilience (Beta>1), and a current valuation that prices in cyclical optimism more moderately compared to LRCX.


2.1 Global WFE Market Overview (2021-2026E)

2.1.1 Market Size and Growth

The global Wafer Fab Equipment (WFE) market is one of the most cyclical segments in the semiconductor value chain. Equipment procurement directly reflects chipmakers' expectations for end-user demand over the next 2-3 years. Therefore, WFE acts as the "second derivative" of the semiconductor industry—driven not just by end demand, but by the rate of change in end demand.

Historical WFE Market Size and Growth (CY2019-CY2027E):

Year WFE Size YoY Growth Rate Driving Factors
CY2019 $48.8B -19% Memory Oversupply + Trade Friction
CY2020 $65B +33% Pandemic Demand + 5nm Ramp-up
CY2021 $90B+ +38% Broad Expansion (Logic + Memory + Mature Nodes)
CY2022 $98B +9% Peak, NAND CapEx Freezing Begins
CY2023 $76B -22% NAND CapEx Freeze + Inventory Adjustment
CY2024 $104B +37% AI Recovery + China Rush Orders
CY2025E $116B +11% Memory Recovery + AI CapEx Kick-off
CY2026E $135B +9% GAA Mass Production + HBM Expansion
CY2027E $145-156B +7-15% Advanced Packaging + Sustained Investment (SEMI vs Gartner Disagreement)

Key disagreements worth special mention: SEMI forecasts CY2027E to reach $145-156B, setting a new historical high, while Gartner is more conservative (CY2026E only at the ~$120B level, +4.4% growth), and warns of a potential "cyclical pause" in CY2027-2028. The core of the disagreement lies in whether AI demand constitutes a "structural demand floor" (SEMI's stance) or a one-time pulse superimposed on traditional cycles (Gartner's stance).

2.1.2 Deconstructing Key Drivers

The current WFE supercycle is formed by the interplay of five major driving forces, ordered by their impact weight:

  1. AI/HPC Chip Demand (Weight ~35%): The combined CapEx of the four hyperscale vendors (Amazon/Google/Microsoft/Meta) is expected to reach over $600B (+36% YoY) by CY2026, with approximately 75% directly allocated to AI infrastructure. This translates downstream to TSMC's advanced process/CoWoS capacity expansion and Samsung/SK Hynix's doubled HBM capacity. For every $100B in data center investment, equipment companies can capture approximately $8B in WFE expenditure.

  2. Advanced Packaging/HBM (Weight ~20%): HBM3E/HBM4 mass production requires a significant amount of new equipment. Samsung's HBM monthly capacity target is 250,000 wafers by end of CY2026 (+47% vs current 170,000 wafers); SK Hynix's total DRAM capacity in 2H26 could reach approximately 620,000 wafers/month (doubling from mid-2023). The CAGR for the advanced packaging equipment TAM is approximately 33% (from $5.5B to $17.5B, CY2024-2028).

  3. Advanced Logic Node Migration (Weight ~20%): TSMC 3nm/2nm + Intel 18A/14A + Samsung 2nm GAA mass production, each generation of node migration increases the number of process steps (from approximately 350 steps for FinFET to approximately 400-600 steps), creating a multiplier effect on equipment demand for etching/deposition/inspection.

  4. Mature Nodes/ICAPS (Weight ~15%): Automotive/Industrial/IoT demand drives capacity expansion for 28nm and above. Although China's rush orders for mature nodes have receded from their peak, global 8-inch fab utilization has recovered from 75-80% to 85-90%, indicating that the digestion cycle is nearing its end.

  5. Geopolitics-Driven Capacity Redundancy (Weight ~10%): "Onshoring" capacity construction driven by the US CHIPS Act, EU Chips Act, and Japan's semiconductor strategy. Projects like TSMC's Arizona fab, Intel's Ohio fab, and Samsung's Texas fab are expected to contribute approximately €12-15 billion in equipment orders for ASML between CY2025-2028.

2.1.3 Equipment Category Distribution

The WFE market is not homogeneous; market size, growth rates, and competitive landscapes vary significantly across different equipment categories:

Equipment Category CY2025E Size % of WFE CAGR (5Y) Competitive Landscape
Lithography ~$28-30B ~25-26% 10-12% ASML Monopoly (EUV 100%, DUV ~85%)
Etch ~$28B ~24-25% 7-8% LRCX 45%, TEL 27%, AMAT 15%
Deposition (CVD/PVD/ALD/ECD) ~$22-24B ~20-21% 8-10% AMAT Leading (PVD ~85%), LRCX (ALD), TEL
Inspection/Metrology ~$15B ~13-14% 7-8% KLAC 63%, Hitachi, Lasertec
CMP/Clean ~$7-8B ~6-7% 5-6% AMAT (CMP 65%), Screen (Clean)
Ion Implantation ~$4-5B ~4% 4-5% AMAT ~70%, Axcelis
Other (Thermal Processing, etc.) ~$8-10B ~7-8% 5-7% TEL, Kokusai

The category structure reveals a key fact: Lithography and Etch collectively account for approximately 50% of WFE, with these two categories dominated by ASML and LRCX, respectively. While AMAT has a presence in multiple categories, it has not achieved absolute leadership in any single high-value category, except for PVD and ion implantation. KLAC's inspection/metrology category accounts for approximately 13-14%, and while not the largest in scale, its growth rate is in sync with or even surpasses WFE (KLA revenue CAGR 15.1% vs WFE CAGR of approximately 8-10%).

2.1.4 WFE Demand Transmission Chain

From terminal AI demand to equipment company revenue, there are multi-level transmission and amplification/attenuation effects:

flowchart TB A["AI/HPC Terminal Demand
Hyperscaler CapEx $600B+"] --> B["Chip Designers
NVDA/AMD/Custom ASICs"] B --> C["Foundry/IDM Capacity Expansion Decisions
TSMC $54B / Samsung / Intel"] C --> D["WFE Procurement Budget Allocation
CY2026E ~$135B"] D --> E1["Lithography ~25%
→ ASML"] D --> E2["Etch ~25%
→ LRCX/TEL/AMAT"] D --> E3["Deposition ~21%
→ AMAT/LRCX/TEL"] D --> E4["Inspection/Metrology ~14%
→ KLAC/Hitachi"] D --> E5["CMP/Ion Implantation/Other ~15%
→ AMAT/TEL, etc."] F["Mature Node Demand
Auto/IoT/ICAPS"] --> G["China/Korea/Japan/Europe/US Mature Fabs"] G --> D H["Advanced Packaging Demand
HBM4/CoWoS/Chiplets"] --> I["Packaging House Capacity Expansion
OSAT + Foundry"] I --> D style A fill:#4a90d9,stroke:#333,color:#fff style D fill:#e8a838,stroke:#333,color:#000 style E1 fill:#6bc46d,stroke:#333,color:#000 style E2 fill:#6bc46d,stroke:#333,color:#000 style E3 fill:#6bc46d,stroke:#333,color:#000 style E4 fill:#6bc46d,stroke:#333,color:#000

Key Characteristics of the Transmission Chain:


2.2 Position of Four Companies in WFE

2.2.1 Category Coverage and Market Share

The four companies have distinctly different positions within the WFE market – ranging from ASML's absolute monopoly in a single category to AMAT's broad coverage across multiple categories, forming the most representative strategic spectrum in the semiconductor equipment industry:

ASML: Lithography Monopolist

Sub-category Market Share Competitors Notes
EUV Lithography 100% None Sole global EUV supplier
DUV Lithography (ArF Immersion) ~85% Nikon (~15%) Advanced nodes still require DUV auxiliary layers
DUV Lithography (KrF/i-line) ~60% Nikon, Canon Mature nodes, lower technical barrier
High-NA EUV 100% None The only choice for 2nm/1.4nm

ASML's monopoly is not only a monopoly in market share but also a monopoly in technology path—without ASML's EUV lithography machines, chips at 3nm and below cannot be manufactured. A single EUV system sells for over €200 million, with High-NA reaching €350 million, making lithography the category with the highest ASP per unit in WFE.

LRCX: Etch/Deposition Dual Engines

Sub-category Market Share Competitors Notes
Etch (Overall) ~45% TEL (~27%), AMAT (~15%) #1, absolute leader
NAND Channel Etch 100% TEL Certas challenging Exclusive, but facing new threats
ALD Deposition Leading AMAT, TEL, ASM FY2025 ALD revenue up 50%+
PECVD Deposition ~25% AMAT CVD ~21% Leading in the second tier

LRCX's core competitiveness is concentrated in the etch segment, particularly in 3D NAND's ultra-high aspect ratio (HAR) etch, where it possesses almost irreplaceable technological advantages. SAM accounts for mid-30s% of WFE, with a target to expand to high-30s%.

AMAT: Multi-Category Generalist

Sub-category Market Share Competitors Notes
PVD ~85% Ulvac, Naura(1%→10%) Highest share in a single category
CVD ~21% LRCX, TEL Second in the market
CMP ~65% Ebara Oligopoly
Ion Implantation ~70% Axcelis Near monopoly
Etch ~15% LRCX, TEL Third in the market
ECD (Electrochemical Deposition) Leading Related to advanced packaging

AMAT covers 8 major independent WFE markets, making it the company with the broadest product portfolio among the Big 5 (product line breadth score 9/10). However, "breadth" has not translated into "depth" advantage—its WFE market share has remained flat at approximately 19% over the past 5 years. R&D expenses of $3.57B, when distributed across 8 product lines, amount to only about $450 million per line, which is lower than the R&D intensity of KLAC and LRCX in their respective core areas.

KLAC: Inspection/Metrology Monopolist

Sub-category Market Share Competitors Notes
Process Control (Overall) ~63% Hitachi, Lasertec 50% in 2010 → 63% in 2024, continuous expansion
Optical Inspection (Brightfield) ~60% Hitachi, limited AMAT Core strength
Photomask (Reticle) Inspection >80% Lasertec (~30%) Near monopoly
Advanced Packaging Inspection ~50% Camtek, AMAT, Onto Rapid expansion from 10%
CD-SEM Metrology 15-20% Hitachi (~70%) Acknowledges Hitachi's lead, does not actively compete

KLAC's strategy is "deep cultivation in a narrow lane"—establishing absolute dominance in the process control WFE segment, but not venturing into other categories like deposition, etch, or lithography. The results are: higher gross margins (62% vs 47-52%), stronger customer stickiness (cross-tool data integration), and lower capital requirements (CapEx 2.8% vs 5-8%).

2.2.2 Category Value vs. Category Share Matrix

The table below maps the competitive positioning of the four companies across two dimensions: "Category Scale" and "Company Share":

Company Core Category Category CY2025E Scale Company Share Company Category Revenue Share Trend
ASML Lithography ~$28-30B ~90%+ ~$26-28B Stable (EUV+High-NA expansion)
LRCX Etch ~$28B ~45% ~$12.6B Stable (TEL challenging)
LRCX Deposition ~$22-24B ~25% ~$5.5-6.0B Rising (ALD growth)
AMAT Deposition (PVD/CVD/ECD) ~$22-24B ~35% ~$7.7-8.4B Stable with slight decline (PVD eroded by Naura)
AMAT CMP+Ion Implantation ~$11-13B ~68% ~$7.5-8.8B Stable
AMAT Etch ~$28B ~15% ~$4.2B Stable
KLAC Inspection/Metrology ~$15B ~63% ~$9.5B Rising (50% in 2010 → 63% in 2024)

Key Insight: ASML and KLAC each hold the highest share in their respective categories, but the category scale differs significantly (Lithography $30B vs. Inspection $15B), which directly explains the revenue and market cap difference between the two. LRCX has the highest share (45%) in the largest non-lithography category (Etch $28B), theoretically possessing the greatest absolute revenue elasticity—but also implying the highest cyclical exposure. AMAT's "breadth" means it has touchpoints across a broad market of $90B+ (non-lithography WFE), but has not established an overwhelming advantage in any single high-value category.

quadrantChart title WFE Category Competitive Positioning (Category Scale vs. Company Share) x-axis "Category Scale (Small)" --> "Category Scale (Large)" y-axis "Company Share (Low)" --> "Company Share (High)" quadrant-1 "Monopoly Heights" quadrant-2 "Niche Dominance" quadrant-3 "Marginal Participation" quadrant-4 "Broad Footprint" "ASML Lithography": [0.85, 0.95] "LRCX Etch": [0.80, 0.65] "KLAC Inspection": [0.45, 0.80] "AMAT Deposition": [0.70, 0.50] "AMAT CMP": [0.25, 0.82] "AMAT Ion Implantation": [0.15, 0.85] "AMAT Etch": [0.80, 0.25] "LRCX Deposition": [0.70, 0.40]

Matrix Interpretation:


2.3 Cyclical Positioning and Demand Visibility (WFE Six-Layer Radar)

2.3.1 Six-Layer Radar Framework

Utilizing the WFE six-layer radar framework defined by the B1 dimension, we analyze the current cycle position layer by layer:

Layer Dimension Current Signal Quantitative Metric Cycle Stage Assessment
L1 End Demand Strong AI/HPC demand, DRAM prices QoQ +90-95%, NAND QoQ +55-60% Soaring prices + supply constraints Expansion Phase (P2)
L2 Customer CapEx TSMC $54B (+32%), WFE CY2026E $135B (+9%), but growth rate decelerates from +37% to +9% New absolute high but decelerating growth rate Approaching Peak (P3)
L3 Total WFE CY2026E $135B (SEMI), 4 consecutive years of growth from CY2024-2027 for the first time in 30 years Historically rare long upturn Mid-to-Late Phase (P2.5)
L4 Category Distribution Advanced packaging equipment TAM CAGR 33%, ALD growth 50%+, Inspection growth surpasses WFE AI-driven category structural change Expansion Phase (P2)
L5 Orders/Backlog ASML Q4 FY2025 orders hit record €13.2B; LRCX deferred revenue +81% YoY but Q2 QoQ -19% Mixed signals Transition Phase (P2.5)
L6 Inventory/Utilization Rate TSMC 3nm/5nm at full utilization, 8-inch utilization recovers to 85-90%; Equipment inventory growth rate lower than revenue growth rate Tight supply-demand balance Expansion Phase (P2)

Overall Weighted Assessment: P2.3-2.7 (Mid-to-late expansion, not yet peaked but growth rate marginally decelerating)

The six-layer radar presents a typical characteristic of "strong demand but marginally decelerating growth":

2.3.2 WFE Cycle Historical Rhythm

Over the past 20 years, the WFE cycle has followed a relatively clear rhythm:

Cycle Upturn Period Duration (Years) Peak Year WFE Post-Peak Decline Driving Factors
Cycle 1 CY1997-2000 3 years ~$28B -46% PC/Internet
Cycle 2 CY2003-2007 4 years ~$40B -34% Mobile/DRAM
Cycle 3 CY2009-2011 2 years ~$38B -18% Smartphones
Cycle 4 CY2016-2018 3 years ~$60B -7% 10nm/7nm+3D NAND
Cycle 5 CY2020-2022 3 years (4 years) ~$98B -22% Pandemic Demand+5nm+HBM
Current CY2024-2027E 4 years (forecast) $145-156B ? AI/HBM Super Cycle
Average 3.2 years -22%

Key Insights from Historical Patterns:

  1. Consecutive WFE upturns exceeding 3 years are extremely rare. If the SEMI forecast of 4 consecutive years of growth from CY2024-2027 materializes, it will be the longest upturn cycle in nearly 30 years.
  2. The average post-peak decline is -22%, but volatility is narrowing (from -46% to -7% then to -22%), reflecting structural improvements from diversified end demand and service revenue buffering.
  3. Decelerating growth pattern confirmed: CY2024 +37% --> CY2025E +11% --> CY2026E +9% --> CY2027E +7%. Even if WFE absolute values continue to reach new highs, the decelerating growth slope is highly consistent with historical cycle patterns 12-18 months before a peak.

2.3.3 "AI Structural Shift" vs. "Traditional Cycle Extension" Debate

In the current market narrative, the biggest divergence is whether AI has fundamentally changed the cyclical nature of WFE:

"Structural Shift" Camp (SEMI/Most Sell-Side):

"Cycle Extension" Camp (Gartner/Some Hedge Funds):

This Report's Stance: We lean towards a "conditional cycle extension" rather than a pure structural shift. While AI indeed creates new equipment demand categories (Advanced Packaging TAM CAGR 33%), the core cyclical mechanisms of WFE—customer CapEx front-loading/back-loading, capacity utilization cycles, and inventory-capacity oscillations—have not been fundamentally altered. The most probable path is that after a continuous upturn from CY2024-2027, a 10-15% correction will occur in CY2028-2029 (rather than the historical average of -22%), as AI demand does provide a higher cycle floor.


2.4 Comparison of Cycle Impact Differences

2.4.1 Core Question

Given the same WFE downturn cycle, why do the four companies experience drastically different impacts? The answer to this question directly determines which company offers the optimal risk-reward ratio at the current cycle position (P2.3-2.7, decelerating growth but still expanding in absolute terms).

2.4.2 Revenue Volatility: Performance Over the Past Two Full Cycles

Metric AMAT LRCX ASML KLAC
FY2023→FY2024 Revenue YoY (WFE Downturn) +2.5% -14.5% +2.6% -6.5%
FY2024→FY2025 Revenue YoY (Recovery Period) +4.4% +23.7% +11.0% +23.9%
2019 Downturn Max Revenue Drawdown -12.7% -22.1% -16.3% -3.8%
CY2020-2021 Upturn Max YoY +18.4% +22.7% +30.2% +33.1%
4Y Revenue CAGR (FY2021-2025) +5.3% +5.9% +13.9% +15.1%
Revenue Volatility Ranking (High→Low) #3 #1 (Highest) #2 #4 (Lowest)

Volatility Interpretation:

2.4.3 Cyclical Buffering Mechanisms: Four Different Hedging Strategies

Each company has developed unique cyclical buffering mechanisms, but their effectiveness varies significantly:

ASML: Order Backlog Buffer (Longest Lag)

ASML's order backlog grew from approximately €15 billion in CY2020 to over €39 billion in CY2024. Based on FY2025 revenue of €31.378 billion, the approximately €39 billion backlog represents about 15 months of revenue coverage. This implies:

LRCX: CSBG Recurring Revenue Buffer (Most Direct Bottom Support)

LRCX's CSBG (Customer Support and Business Group) FY2025 revenue is $6.94B, accounting for 37.7% of total revenue, with YoY growth of 16.0%. CSBG's SaaS-like characteristics provide LRCX with cyclical bottom support:

However, the effectiveness of the CSBG buffer is limited: FY2024 total revenue still declined by -14.5%, indicating that the magnitude of the Systems decline far exceeded CSBG's growth in offsetting capacity. A 37.7% recurring revenue share means that 62.3% of Systems revenue remains fully exposed to the WFE cycle.

KLAC: Essential Inspection + Low Cyclical Beta + Service Buffer

KLAC's cyclical defense comes from three levels:

  1. Essential Nature of Inspection Equipment: Inspection is the "insurance policy" for fabs — fabs can delay capacity expansion (reducing etch/deposition procurement) but cannot lower yield monitoring standards for production capacity. This asymmetry is the structural source of KLAC's downside Beta < 1.
  2. Ballast of Service Business: Service revenue of $2.68B (22%), 52 consecutive quarters (13 years) of YoY growth, 75% subscription contracts + 95% renewal rate.
  3. Historical Beta Analysis: Down-cycle Beta < 1 (CY2018-2019: 0.57x), Up-cycle Beta > 1 (CY2020-2021: 1.38x, CY2023-2024: 2.67x). However, in 5 out of 5 WFE downturn periods, KLAC's organic revenue experienced negative growth — Beta < 1 does not mean positive growth, but merely a smaller decline than the market.

AMAT: Product Line Breadth + AGS Services

AMAT's 8 product lines theoretically offer diversification as a hedge, but the actual effect is limited:

2.4.4 Profitability Resilience in Downturns

Profitability performance during cyclical downturns reveals differences in each company's "cost rigidity" and pricing power:

5-Year Gross Margin Corridor (FY2021-FY2025):

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